The cure behavior of tetraglycidyl diaminodiphenyl methane with diaminodiphenyl sulfone

G. Jiawu, S. Kui, Zong Mong Gao Zong Mong

Research output: Contribution to journalArticlepeer-review


It is well known that the preparation of an high-performance composite product depends not only on raw materials (resin and fiber) but also on the curing technological condition, or rather, the determination of the curing technological parameters. In this study torsional braid analysis (TBA) is used to study the cure behavior of tetraglycidyl diaminodiphenyl methane (TGDDM or Ag-80) with diaminodiphenyl sulfone (DDS), providing theoretical data for determining the curing condition of this resin matrix composites. Isothermal TBA technique is used to obtain a time-temperature-transformation (TTT) cure diagram, according to which the three different types of cure behavior are discussed. The data for T(g) for different cure temperatures and times provide and estimation of the time to full cure vs. isothermal cure temperature for the resin system. An empirical T(g)-T(c)-time (TTT) equation is also developed. (C) 2000 Elsevier Science B.V.

Original languageEnglish (US)
Pages (from-to)153-158
Number of pages6
JournalThermochimica Acta
StatePublished - Jul 3 2000
Externally publishedYes


  • Cure behavior
  • Epoxy resin
  • TBA
  • TTT diagram
  • TTT equation

ASJC Scopus subject areas

  • Physical and Theoretical Chemistry

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