MTF measurements with high-resolution a-Si:H imaging arrays

John Yorkston, Larry E. Antonuk, N. Seraji, W. Huang, J. H. Siewerdsen, Y. El-Mohri

Research output: Chapter in Book/Report/Conference proceedingConference contribution


Recent advances in a-Si:H fabrication technology have opened the way for the application of flat panel imaging arrays in a number of areas in medical imaging. Their large area (up to approximately 26 × 26 cm), thin profile (< 1 mm) and real time readout capability make them strong candidates for the replacement of more traditional x-ray imaging technologies such as film and image intensifier systems. As a first step towards a device suitable for clinical use we have created a 24.4 × 19.4 cm array with 127 μm pitch pixels. This device serves as a testbed for investigating the effects of design changes on array imaging performance. This paper reports on initial measurements of the spatial resolution of this device used in conjunction with an overlaying Lanex Regular screen and 90 kVp x rays. The measured pre-sampled modulation transfer function (p.s. MTF) is found to fall below the predicted value by up to approximately 8%. At least part of this reduction seems to be due to scattering of light photons between the array and the surface of the phosphor screen contacting the array.

Original languageEnglish (US)
Title of host publicationProceedings of SPIE - The International Society for Optical Engineering
EditorsRichard L. Van Metter, Jacob Beutel
Number of pages10
StatePublished - Dec 1 1995
Externally publishedYes
EventMedical Imaging 1995: Physics of Medical Imaging - San Diego, CA, USA
Duration: Feb 26 1995Feb 27 1995

Publication series

NameProceedings of SPIE - The International Society for Optical Engineering
ISSN (Print)0277-786X


OtherMedical Imaging 1995: Physics of Medical Imaging
CitySan Diego, CA, USA

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Computer Science Applications
  • Applied Mathematics
  • Electrical and Electronic Engineering


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