A facile fabrication process for bulk PZT microsystems using dry film photoresist and micro powder blasting is presented. Bulk PZT and dry film photoresist etching characteristics are evaluated as a function of process parameters and mask dimensions using 127m thick PZT substrates. The resulting process simplifies microscale patterning of bulk PZT compared with existing methods, with selection of suitable etching parameter providing excellent etch rate, selectivity and anisotropy. The technique is used to fabricate two different cantilever microactuator topologies based on piezoelectric d 31and d 33mode actuation, demonstrating the capabilities of the patterning method for applications in bulk PZT microelectromechanical systems (MEMS).
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Mechanics of Materials
- Mechanical Engineering
- Electrical and Electronic Engineering