TY - GEN
T1 - Microfabrication and self-assembly of 3D microboxes for biomedical applications
AU - Leong, Timothy
AU - Ye, Hongke
AU - Call, Emma
AU - Gimi, Barjor
AU - Bhujwalla, Zaver
AU - Gracias, David H.
PY - 2006
Y1 - 2006
N2 - This paper reports a novel method for fabricating three dimensional (3D) metallic micropatterned boxes by self-assembly of two dimensional (2D) precursors. A 3D micropatterned device has several advantages over its two dimensional (2D) counterpart - a larger surface area to volume ratio, thereby maximizing interactions with the surrounding medium and providing space to mount different electromechanical modules, and a finite volume allowing encapsulation of functional elements. The microboxes can be constructed in different sizes with perforations on either one or on all faces. We demonstrate encapsulation of gels and polymers within the boxes, and release of chemicals by heating. We envision the use of these boxes in cellular encapsulation and remote release of drugs and biological media in-vitro and in-vivo.
AB - This paper reports a novel method for fabricating three dimensional (3D) metallic micropatterned boxes by self-assembly of two dimensional (2D) precursors. A 3D micropatterned device has several advantages over its two dimensional (2D) counterpart - a larger surface area to volume ratio, thereby maximizing interactions with the surrounding medium and providing space to mount different electromechanical modules, and a finite volume allowing encapsulation of functional elements. The microboxes can be constructed in different sizes with perforations on either one or on all faces. We demonstrate encapsulation of gels and polymers within the boxes, and release of chemicals by heating. We envision the use of these boxes in cellular encapsulation and remote release of drugs and biological media in-vitro and in-vivo.
UR - http://www.scopus.com/inward/record.url?scp=33750121497&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=33750121497&partnerID=8YFLogxK
M3 - Conference contribution
AN - SCOPUS:33750121497
SN - 0780394755
SN - 9780780394759
T3 - Proceedings of the IEEE International Conference on Micro Electro Mechanical Systems (MEMS)
SP - 502
EP - 505
BT - 19th IEEE International Conference on Micro Electro Mechanical Systems
T2 - 19th IEEE International Conference on Micro Electro Mechanical Systems
Y2 - 22 January 2006 through 26 January 2006
ER -