Abstract
Silver electrochemical migration results in the degradation of surface insulation resistance, and has been attributed to the dendritic bridge between adjacent conductors. We report on the surface insulation resistance decrease prior to the dendritic bridge. The silver ECM mechanism in the initial stage of resistance decrease was analyzed and has been determined to be due to the continuous generation and accumulation of silver ions. Resistance decrease paths may be established prior to the appearance of dendritic migration paths. The investigation shows that the initial stage of ECM is also the rate controlling stage.
| Original language | English (US) |
|---|---|
| Pages (from-to) | 1915-1921 |
| Number of pages | 7 |
| Journal | Microelectronics Reliability |
| Volume | 46 |
| Issue number | 9-11 |
| DOIs | |
| State | Published - Sep 2006 |
| Externally published | Yes |
ASJC Scopus subject areas
- Electronic, Optical and Magnetic Materials
- Atomic and Molecular Physics, and Optics
- Condensed Matter Physics
- Safety, Risk, Reliability and Quality
- Surfaces, Coatings and Films
- Electrical and Electronic Engineering