Initial stage of silver electrochemical migration degradation

S. Yang, J. Wu, A. Christou

Research output: Contribution to journalArticlepeer-review

Abstract

Silver electrochemical migration results in the degradation of surface insulation resistance, and has been attributed to the dendritic bridge between adjacent conductors. We report on the surface insulation resistance decrease prior to the dendritic bridge. The silver ECM mechanism in the initial stage of resistance decrease was analyzed and has been determined to be due to the continuous generation and accumulation of silver ions. Resistance decrease paths may be established prior to the appearance of dendritic migration paths. The investigation shows that the initial stage of ECM is also the rate controlling stage.

Original languageEnglish (US)
Pages (from-to)1915-1921
Number of pages7
JournalMicroelectronics Reliability
Volume46
Issue number9-11
DOIs
StatePublished - Sep 1 2006

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Atomic and Molecular Physics, and Optics
  • Safety, Risk, Reliability and Quality
  • Condensed Matter Physics
  • Surfaces, Coatings and Films
  • Electrical and Electronic Engineering

Fingerprint

Dive into the research topics of 'Initial stage of silver electrochemical migration degradation'. Together they form a unique fingerprint.

Cite this