Finite element analysis of field distributions in the cerebral cortex generated by electrical stimulation

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A three dimensional (3D) finite element model (FEM) of the human head was built from discretized transverse Magnetic Resonance Imaging (MRI) scans. This model was used to investigate the current density and electric field distributions in the cerebral cortex generated by electrical stimulation. High resolution two dimensional models were built to study electrode designs. Bipolar stimulation is very effective in localized stimulation, but requires a higher stimulating current. Unipolar stimulation has a lower current threshold for producing stimulation, but it stimulates a larger region of the cortex. CSF provides an excellent shunting path for the stimulating current.

Original languageEnglish (US)
Title of host publicationProceedings of the Annual Conference on Engineering in Medicine and Biology
PublisherPubl by IEEE
Pages515-516
Number of pages2
Editionpt 2
ISBN (Print)0780302168
StatePublished - Dec 1 1991
Externally publishedYes
EventProceedings of the 13th Annual International Conference of the IEEE Engineering in Medicine and Biology Society - Orlando, FL, USA
Duration: Oct 31 1991Nov 3 1991

Publication series

NameProceedings of the Annual Conference on Engineering in Medicine and Biology
Numberpt 2
Volume13
ISSN (Print)0589-1019

Other

OtherProceedings of the 13th Annual International Conference of the IEEE Engineering in Medicine and Biology Society
CityOrlando, FL, USA
Period10/31/9111/3/91

ASJC Scopus subject areas

  • Signal Processing
  • Biomedical Engineering
  • Computer Vision and Pattern Recognition
  • Health Informatics

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  • Cite this

    Nathan, S. S., Thakor, N. V., Lesser, R. P., & Gordon, B. (1991). Finite element analysis of field distributions in the cerebral cortex generated by electrical stimulation. In Proceedings of the Annual Conference on Engineering in Medicine and Biology (pt 2 ed., pp. 515-516). (Proceedings of the Annual Conference on Engineering in Medicine and Biology; Vol. 13, No. pt 2). Publ by IEEE.