TY - JOUR
T1 - Eliminating process-related defects during the fabrication of copper interconnects
AU - Oh, Minseok
AU - Ramappa, Deepak A.
AU - Contestable-Gilkes, Daniele
AU - Merchant, Sailesh M.
AU - Jones, Douglas E.
AU - Subramanian, Karthikeyan
AU - Lytle, Steve
AU - Oladeji, Isaiah
AU - Seet, Chim Seng
AU - Li, He Ming
PY - 2001/12/1
Y1 - 2001/12/1
N2 - The results of a systematic study undertaken to identify process related defects introduced during the fabrication of low-k dielectric based copper interconnects was presented. The copper electroplating process was examined to reduce the number of plating related defects. The defects from the electroplating process were classified into a defect pareto chart. Efforts were made to reduce defects that were known to be detrimental in device performance.
AB - The results of a systematic study undertaken to identify process related defects introduced during the fabrication of low-k dielectric based copper interconnects was presented. The copper electroplating process was examined to reduce the number of plating related defects. The defects from the electroplating process were classified into a defect pareto chart. Efforts were made to reduce defects that were known to be detrimental in device performance.
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M3 - Conference article
AN - SCOPUS:0035555359
SN - 1048-0854
SP - 85
EP - 89
JO - Advanced Metallization Conference (AMC)
JF - Advanced Metallization Conference (AMC)
T2 - Advanced Metallization Conference 2001 (AMC 2001)
Y2 - 8 October 2001 through 11 October 2001
ER -