TY - GEN
T1 - Design and evaluation of corner compensation patterns for anisotropic etching
AU - Chen, Xing
AU - Lee, Dong Weon
AU - Park, Jong Sung
PY - 2007
Y1 - 2007
N2 - This paper reports corner compensation methods for fabricating the intact mesa structure in MEMS (Micro-Electro-Mechanical System). To investigate the undercutting problem in the mesa structure, over ten corner compensation patterns are designed by computing the relations among a series of parameters, e.g. etching rates in different crystal planes, etching depth, etching times, etc. The compensation patterns are then simulated by the simulation software Anisotropic Crystalline Etch Simulation (ACES) beta 2, the 3D etching simulations are gotten. Various new compensation structures preventing the undercutting of convex corners of (100) silicon in THAH solution are redesigned and optimized based on the simulation results, the fabrication are conducted to verify the feasibility of the corner compensation patterns.
AB - This paper reports corner compensation methods for fabricating the intact mesa structure in MEMS (Micro-Electro-Mechanical System). To investigate the undercutting problem in the mesa structure, over ten corner compensation patterns are designed by computing the relations among a series of parameters, e.g. etching rates in different crystal planes, etching depth, etching times, etc. The compensation patterns are then simulated by the simulation software Anisotropic Crystalline Etch Simulation (ACES) beta 2, the 3D etching simulations are gotten. Various new compensation structures preventing the undercutting of convex corners of (100) silicon in THAH solution are redesigned and optimized based on the simulation results, the fabrication are conducted to verify the feasibility of the corner compensation patterns.
UR - http://www.scopus.com/inward/record.url?scp=39049142658&partnerID=8YFLogxK
UR - http://www.scopus.com/inward/citedby.url?scp=39049142658&partnerID=8YFLogxK
U2 - 10.1117/12.787617
DO - 10.1117/12.787617
M3 - Conference contribution
AN - SCOPUS:39049142658
SN - 9780819468802
T3 - Proceedings of SPIE - The International Society for Optical Engineering
BT - 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies
T2 - 3rd International Symposium on Advanced Optical Manufacturing and Testing Technologies: Optical Test and Measurement Technology and Equipment
Y2 - 8 July 2007 through 12 July 2007
ER -