Decoding peripheral nerve sensory information with a spiked flexible neural interface

Jiahui Wang, Xin Yuan Thow, Hao Wang, Sanghoon Lee, Kai Voges, Nitish V Thakor, Shih Cheng Yen, Chengkuo Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

Wearable artificial sensors are proposed as a way to capture information for restoration of sensory feedback to persons with tetraplegia. However, the ability of these artificial sensors is limited. One relatively unexplored approach is to make use of the signals from surviving tactile and proprioceptive receptors by recording from the transmitting axons. In this paper, we describe a spiked ultraflexible neural (SUN) interface, which can be implanted into the peripheral nervous system (PNS) to capture sensory information. The 3D design, which integrates spiked structures for intrafascicular nerve recording with flexible substrate, enables a conformal interface to the target nerve.

Original languageEnglish (US)
Title of host publication2018 IEEE Micro Electro Mechanical Systems, MEMS 2018
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages182-185
Number of pages4
Volume2018-January
ISBN (Electronic)9781538647820
DOIs
StatePublished - Apr 24 2018
Externally publishedYes
Event31st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2018 - Belfast, United Kingdom
Duration: Jan 21 2018Jan 25 2018

Other

Other31st IEEE International Conference on Micro Electro Mechanical Systems, MEMS 2018
CountryUnited Kingdom
CityBelfast
Period1/21/181/25/18

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Condensed Matter Physics
  • Mechanical Engineering
  • Electrical and Electronic Engineering

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  • Cite this

    Wang, J., Thow, X. Y., Wang, H., Lee, S., Voges, K., Thakor, N. V., Yen, S. C., & Lee, C. (2018). Decoding peripheral nerve sensory information with a spiked flexible neural interface. In 2018 IEEE Micro Electro Mechanical Systems, MEMS 2018 (Vol. 2018-January, pp. 182-185). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/MEMSYS.2018.8346514