Contact resistance estimation for time-dependent silicone elastomer matrix of land grid array socket

Shuang Yang, Ji Wu, Derek Tsai, Michael G. Pecht

Research output: Contribution to journalArticlepeer-review

Abstract

A land grid array (LGA) socket provides high- density, electrically-separable interconnect between a component and a printed circuit board. The LGA socket must not be susceptible to creep and stress relaxation, which can lead to loss of contact force and consequently the degradation of contact resistance. In this paper, the time-dependent contact resistance failure mechanisms were experimentally assessed and theoretically analyzed for silicone elastomer matrix socket interconnects. A time-dependent physics-of-failure model was developed for contact resistance simulation.

Original languageEnglish (US)
Pages (from-to)81-85
Number of pages5
JournalIEEE Transactions on Components and Packaging Technologies
Volume30
Issue number1
DOIs
StatePublished - Mar 1 2007

Keywords

  • Contact force
  • Contact resistance
  • Creep
  • Land grid array (LGA)
  • Socket
  • Stress relaxation

ASJC Scopus subject areas

  • Electronic, Optical and Magnetic Materials
  • Electrical and Electronic Engineering

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