Chip positioning by relating the positions of solder balls and mating connection pads (vias) indirectly - by determining the positional relationship of balls and of vias separately to a reference mark, rather than to each other - increases total positional accuracy and convenience. Two measured relationships are outlined. They can be used to determine the solder ball/via pad misalignment and from that determination produce a command to the placement tool to correct the misalignment.
|Original language||English (US)|
|Number of pages||3|
|Journal||IBM technical disclosure bulletin|
|State||Published - Nov 1984|
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