A stainless-steel-based capacitive pressure sensor chip and its microwelding integration

Xing Chen, Daniel Brox, Babak Assadsangabi, Mohamed Sultan Mohamed Ali, Kenichi Takahata

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

A stainless-steel (SS) chip of capacitive pressure sensor and its new integration method are developed. The sensors are microfabricated through thermal bonding of the chip dies made of medical-grade SS to the Au-polyimide diaphragm film. The capacitive cavity design with dead-end holes is verified to increase the pressure sensitivity. Laser microwelding is applied to permanently bond the sensor chips onto SS substrates. The microwelding is revealed to provide twice the mechanical strength and ∼6× electrical conductance in its bond compared with a conductive epoxy case. The microwelded sensor exhibits an average sensitivity of 120 ppm/mmHg close to its pre-welding level. The welding integration with a SS antenna stent is demonstrated. The results suggest that laser microwelding is a promising packaging technique for SS-based biomedical and implant microdevices that require long-term bond reliability.

Original languageEnglish (US)
Title of host publication2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages1081-1084
Number of pages4
ISBN (Electronic)9781479989553
DOIs
StatePublished - Aug 5 2015
Event18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015 - Anchorage, United States
Duration: Jun 21 2015Jun 25 2015

Publication series

Name2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015

Other

Other18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
CountryUnited States
CityAnchorage
Period6/21/156/25/15

Keywords

  • Capacitive pressure sensors
  • MEMS
  • biomedical microdevices
  • laser microwelding
  • stainless steels
  • stents

ASJC Scopus subject areas

  • Instrumentation
  • Electrical and Electronic Engineering

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  • Cite this

    Chen, X., Brox, D., Assadsangabi, B., Mohamed Ali, M. S., & Takahata, K. (2015). A stainless-steel-based capacitive pressure sensor chip and its microwelding integration. In 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015 (pp. 1081-1084). [7181114] (2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015). Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TRANSDUCERS.2015.7181114