A robust, fast electrothermal micromirror with symmetric bimorph actuators made of copper/tungsten

Xiaoyang Zhang, Boxiao Li, Xingde Li, Huikai Xie

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Abstract

This paper reports a fast, robust electrothermal bimorph micromirror with a symmetric inverse-series-connected bimorph actuator. The actuator is made up of symmetric Cu-W bimorphs with high sensitivity and fast thermal response. A unique backside DRIE release process is developed to keep the mirror surface intact during release. The micromirror is able to perform both piston and tip-tilt motion. A maximum piston displacement of 169 μm is achieved with lateral shift less than 1.5 μm at the driving voltage of only 2.3 V. The maximum optical angle achieved is ±13° at 2.3 V. This mirror gives fast thermal response of less than 7.5 ms. The resonances of the piston and tip-tilt modes are 1.58 kHz and 2.74 kHz, respectively.

Original languageEnglish (US)
Title of host publication2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
PublisherInstitute of Electrical and Electronics Engineers Inc.
Pages912-915
Number of pages4
ISBN (Electronic)9781479989553
DOIs
StatePublished - Aug 5 2015
Event18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015 - Anchorage, United States
Duration: Jun 21 2015Jun 25 2015

Other

Other18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015
CountryUnited States
CityAnchorage
Period6/21/156/25/15

Fingerprint

pistons
Pistons
Tungsten
tungsten
Mirrors
Actuators
Piston displacement
actuators
Copper
copper
mirrors
Electric potential
sensitivity
shift
electric potential
Hot Temperature

Keywords

  • electrothermal actuation
  • inverse-series-connected
  • MEMS mirror
  • symmetric bimorph

ASJC Scopus subject areas

  • Instrumentation
  • Electrical and Electronic Engineering

Cite this

Zhang, X., Li, B., Li, X., & Xie, H. (2015). A robust, fast electrothermal micromirror with symmetric bimorph actuators made of copper/tungsten. In 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015 (pp. 912-915). [7181072] Institute of Electrical and Electronics Engineers Inc.. https://doi.org/10.1109/TRANSDUCERS.2015.7181072

A robust, fast electrothermal micromirror with symmetric bimorph actuators made of copper/tungsten. / Zhang, Xiaoyang; Li, Boxiao; Li, Xingde; Xie, Huikai.

2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015. Institute of Electrical and Electronics Engineers Inc., 2015. p. 912-915 7181072.

Research output: Chapter in Book/Report/Conference proceedingConference contribution

Zhang, X, Li, B, Li, X & Xie, H 2015, A robust, fast electrothermal micromirror with symmetric bimorph actuators made of copper/tungsten. in 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015., 7181072, Institute of Electrical and Electronics Engineers Inc., pp. 912-915, 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015, Anchorage, United States, 6/21/15. https://doi.org/10.1109/TRANSDUCERS.2015.7181072
Zhang X, Li B, Li X, Xie H. A robust, fast electrothermal micromirror with symmetric bimorph actuators made of copper/tungsten. In 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015. Institute of Electrical and Electronics Engineers Inc. 2015. p. 912-915. 7181072 https://doi.org/10.1109/TRANSDUCERS.2015.7181072
Zhang, Xiaoyang ; Li, Boxiao ; Li, Xingde ; Xie, Huikai. / A robust, fast electrothermal micromirror with symmetric bimorph actuators made of copper/tungsten. 2015 Transducers - 2015 18th International Conference on Solid-State Sensors, Actuators and Microsystems, TRANSDUCERS 2015. Institute of Electrical and Electronics Engineers Inc., 2015. pp. 912-915
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