A functional microprobe integrated with sharp tip and huge deflection crank-slider structural cantilever for versatile instrument

X. Chen, D. W. Lee

Research output: Chapter in Book/Report/Conference proceedingConference contribution

1 Scopus citations

Abstract

The paper reports a microcantilever-based microprobe that will be applied at a versatile instrument in combination of atomic force microscopy with mass spectrometry. Due to the special requirements for the microprobe, the probe is expected to equip with an in-plane sharp tip for high-resolution image scanning and easy sample electrical extraction, as well as a self-actuated cantilever that owns huge deflection in order to freely switch between two terminals. Therefore, a new concept of new actuation and vibrating mode for cantilevers is presented, where a crank-slider structural cantilever connected to integrated in-plane actuators and a sharp tip are monolithically constructed, serving as a functional microprobe. A newly wet and dry etching hybrid method is introduced to easily fabricate the sharp tip with various aspect ratios. To get big out-of-plane deflection of cantilever, optimized design has been considered and carefully calculated, finally proved by experimental results.

Original languageEnglish (US)
Title of host publication2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
Pages1721-1724
Number of pages4
DOIs
StatePublished - 2011
Externally publishedYes
Event2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11 - Beijing, China
Duration: Jun 5 2011Jun 9 2011

Publication series

Name2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11

Other

Other2011 16th International Solid-State Sensors, Actuators and Microsystems Conference, TRANSDUCERS'11
Country/TerritoryChina
CityBeijing
Period6/5/116/9/11

Keywords

  • Huge deflection
  • Microcantilever
  • Microprobe

ASJC Scopus subject areas

  • Hardware and Architecture
  • Electrical and Electronic Engineering

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